Bhubaneswar: Odisha’s capital city will host India’s first advanced 3D glass semiconductor packaging unit, with chief minister Mohan Charan Majhi set to lay the foundation stone for the Rs 1,943crore project on Sunday.The facility will be set up by Heterogeneous Integration Packaging Solutions, also known as 3D Glass Solutions. The state govt said the project will bring advanced chip packaging technology to India, create about 2,500 jobs and strengthen the state’s position in the global semiconductor landscape.Officials said the unit represents a breakthrough for India’s chip ecosystem by introducing one of the most sophisticated packaging technologies now available.
The project is expected to place Odisha at the forefront of next-generation semiconductor manufacturing and packaging.The state’s electronics and IT department said the ceremony is taking place just months after Union Cabinet approval, underlining the pace of execution. Once operational, the plant at Info Valley will have the capacity to produce 50 million assembled units annually, adding significant scale to India’s semiconductor value chain.
The packaged chips will serve key sectors such as aerospace, defence, artificial intelligence, 5G and data centres. This gives the project strong commercial value while also supporting India’s push to build domestic strength in strategic technologies.With the new unit, Odisha becomes the first state in India to host both a compound semiconductor fabrication facility and an advanced 3D chip packaging plant using glass substrates.
The state govt said this reflects Odisha’s growing semiconductor ecosystem and its efforts to attract high-technology investment.The project also fits into the larger Atmanirbhar Bharat vision by promoting advanced manufacturing and technology-based employment. Odisha is aiming to emerge as a leading destination for semiconductor and electronics investment.Union electronics and IT minister Ashwini Vaishnaw and electronics and IT minister Mukesh Mahaling will attend the event along with senior officials, industry leaders, investors and academic representatives.
